{"id":2547326,"date":"2023-03-28T03:01:07","date_gmt":"2023-03-28T07:01:07","guid":{"rendered":"https:\/\/wordpress-1016567-4521551.cloudwaysapps.com\/plato-data\/chip-industrys-technical-paper-roundup-mar-28\/"},"modified":"2023-03-28T03:01:07","modified_gmt":"2023-03-28T07:01:07","slug":"chip-industrys-technical-paper-roundup-mar-28","status":"publish","type":"station","link":"https:\/\/platodata.io\/plato-data\/chip-industrys-technical-paper-roundup-mar-28\/","title":{"rendered":"Chip Industry\u2019s Technical Paper Roundup: Mar. 28"},"content":{"rendered":"
GAAFETs; thermal simulation in 3DIC; zero trust environments; silicon photonics MEMS; semi-metals for interconnects; logic locking at the RTL; mechanical overtone frequency combs; photonics: GaSb\/SiN tunable hybrid integrated laser; domain wall-magnetic tunnel junction analog content addressable memory.<\/p>\n<\/p><\/div>\n
New technical papers recently added to Semiconductor Engineering\u2019s library:<\/p>\n