{"id":2547326,"date":"2023-03-28T03:01:07","date_gmt":"2023-03-28T07:01:07","guid":{"rendered":"https:\/\/wordpress-1016567-4521551.cloudwaysapps.com\/plato-data\/chip-industrys-technical-paper-roundup-mar-28\/"},"modified":"2023-03-28T03:01:07","modified_gmt":"2023-03-28T07:01:07","slug":"chip-industrys-technical-paper-roundup-mar-28","status":"publish","type":"station","link":"https:\/\/platodata.io\/plato-data\/chip-industrys-technical-paper-roundup-mar-28\/","title":{"rendered":"Chip Industry\u2019s Technical Paper Roundup: Mar. 28"},"content":{"rendered":"
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Industry Research<\/a> <\/div>\n
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GAAFETs; thermal simulation in 3DIC; zero trust environments; silicon photonics MEMS; semi-metals for interconnects; logic locking at the RTL; mechanical overtone frequency combs; photonics: GaSb\/SiN tunable hybrid integrated laser; domain wall-magnetic tunnel junction analog content addressable memory.<\/p>\n<\/p><\/div>\n

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\"popularity\" <\/div><\/div><\/div>\n
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New technical papers recently added to Semiconductor Engineering\u2019s library:<\/p>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
Technical Paper<\/th>\nResearch Organizations<\/th>\n<\/tr>\n<\/thead>\n
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ReTrustFSM: Toward RTL Hardware Obfuscation-A Hybrid FSM Approach<\/a><\/td>\nUniversity of Florida<\/td>\n<\/tr>\n
Photonics:<\/a> GaSb\/SiN Tunable Hybrid Integrated Laser<\/td>\nTampere University <\/td>\n<\/tr>\n
Exploring Topological Semi-Metals for Interconnects<\/a><\/td>\nPenn State, IBM, and Rice University, with funding by Semiconductor Research Corporation (SRC)<\/td>\n<\/tr>\n
DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design<\/a><\/td>\nUCSB and Cadence<\/td>\n<\/tr>\n
A Review <\/a> of the Gate-All-Around Nanosheet FET Process Opportunities<\/td>\nIBM Research Albany<\/td>\n<\/tr>\n
Integrated silicon photonic MEMS<\/a><\/td>\nEPFL, University of Sydney, CSEM, KTH Royal Institute of Technology, Ghent University, Imec, and Tyndall National Institute<\/td>\n<\/tr>\n
Mechanical overtone frequency combs<\/a><\/td>\nDelft University of Technology, Ahmedabad University and NIST<\/td>\n<\/tr>\n
Towards Hardware-Based Application Fingerprinting with Microarchitectural Signals for Zero Trust Environments<\/a><\/td>\nAir Force Institute of Technology<\/td>\n<\/tr>\n
Domain Wall-Magnetic Tunnel Junction Analog Content Addressable Memory Using Current and Projected Data<\/a><\/td>\nUT Austin and Samsung Advanced Institute of Technology (SAIT)<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us posting links to papers. Please send suggestions (via comments section below) for what else you\u2019d like us to incorporate.<\/p>\n

More Reading<\/strong>
Technical Paper Library home<\/a><\/em><\/p>\n

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\"Linda <\/div>\n
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Linda Christensen <\/h3>\n

  (all posts)<\/a><\/small>
Linda Christensen is vice president of operations and a contributing writer at Semiconductor Engineering. <\/div><\/div>\n